| • रेणु परिसीमा विसरण | |
| grain: दाना धान्य फसल बीज | |
| grain boundary: दाना परिसीमा रेणु | |
| boundary: चौहद्दी मेढ़ सीमा | |
| diffusion: छितराव प्रचार | |
grain boundary diffusion मीनिंग इन हिंदी
grain boundary diffusion उदाहरण वाक्य
उदाहरण वाक्य
अधिक: आगे- This scheme prohibits dislocation pile-up and instead results in grain boundary diffusion.
- This enhances grain boundary diffusion and migration as well as densification of the material.
- Densification is only achieved at temperatures above 1800 �C once grain boundary diffusion mechanisms become active.
- Diffusion processes caused by electromigration can be divided into grain boundary diffusion, bulk diffusion and surface diffusion.
- The " grain boundary diffusion " terms the free migration of atoms in free atomic lattice spaces.
- Grain boundary diffusion is significant in face centered cubic metals below about 0.8 T melt ( Absolute ).
- In general, grain boundary diffusion is the major electromigration process in aluminum wires, whereas surface diffusion is dominant in copper interconnects.
- In general, surface diffusion occurs much faster than grain boundary diffusion, and grain boundary diffusion occurs much faster than lattice diffusion.
- In general, surface diffusion occurs much faster than grain boundary diffusion, and grain boundary diffusion occurs much faster than lattice diffusion.
- Atomic diffusion in polycrystalline materials is therefore often modeled using an effective diffusion coefficient, which is a combination of lattice, and grain boundary diffusion coefficients.
